Roboter-Nahfeldmessung unter Verwendung der Einzelsonden-OTF-Technik

Kontakt: Dr. Cheng Yang (Oberingenieur)

Die Nahfeldmessung (NFS) spielt eine entscheidende Rolle bei der Bewertung der Strahlung und Emission von elektromagnetischen (EM) Feldern, die von Mikrowellengeräten und -komponenten ausgehen. In den letzten Jahrzehnten wurden erhebliche Fortschritte bei der Verbesserung der Scankapazitäten erzielt, einschließlich des Einsatzes von Robotik, Hochgeschwindigkeitsgerätekommunikation und Ausrüstung mit hoher Abtastrate. Trotz dieser Fortschritte sind die Zeit- und Kostenbeschränkungen für Messungen immer noch durch Anforderungen an groß angelegte, hochauflösende Magnituden- und Phasenmessungen begrenzt, insbesondere in Bezug auf integrierte Schaltungen (IC) und Antennenanwendungen im Zusammenhang mit elektromagnetischer Verträglichkeit (EMV) Tests.

Dieses Projekt zielt darauf ab, die Zeit- und Kostenbelastungen herkömmlicher Nahfeldmessungen (NFS) um das Zehnfache zu reduzieren, ohne dabei die Genauigkeit zu beeinträchtigen. Dies wird durch den Einsatz einer innovativen Einzelsonden-On-the-Fly (OTF)-Datenakquisitions- und Verarbeitungstechnik erreicht. Als Nachweis wurde eine Spulenantennenbeispiel getestet, wie in (a) und (b) dargestellt. Die Technik wird auf kostengünstige Innen- und Außen-EMV-Tests bis zu GHz-Frequenzen ausgeweitet.

Publikationen

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Hamideh Esmaeili, Cheng Yang, Christian Schuster

Efficient Iterative Data Generation Using Evaluation of Prioritized Input Parameters in ANNs for SAR Prediction in Human Head Models at 13.56 MHz Artikel

In: IEEE Transactions on Electromagnetic Compatibility, Early Access, pp. 1-11, 2024.

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Cheng Yang, Christian Adam, Sebastian Götschel

Complex Near-Field Measurement Using On-The-Fly Scan with In-phase and Quadrature Demodulation Proceedings Article

In: 15 German Microwave Conference (GeMiC), Duisburg, Germany, March 11-12, 2024.

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Hamideh Esmaeili, Cheng Yang, Christian Schuster

Physics Inspired Artificial Neural Network Adaptation for SAR Prediction in Bio-EM Problems Proceedings Article

In: The 2023 International Microwave Biomedical Conference, Leuven, Belgium, September 11-13, 2023.

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Cheng Yang, Christian Adam, Sebastian Götschel

Single-probe Near-field Phase Retrieval using On-The-Fly Scan and Hilbert Transform Proceedings Article

In: EMC Europe 2023, Krakow, Poland, September 04-08, 2023.

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Hamideh Esmaeili, Cheng Yang, Christian Schuster

SAR Prediction in Human Head Tissues with Varying Material Parameters Using an Artificial Neural Network Proceedings Article

In: Annual Conference of BioEM, Oxford, United Kingdom, June 18-24, 2023.

Jose Enrique Hernandez-Bonilla, Golzar Alavi, Cheng Yang, Christian Schuster

Measurement of Temperature and Humidity Dependance of Automotive-Grade Interconnects Proceedings Article

In: IEEE Workshop on Signal and Power Integrity (SPI), Aveiro, Portugal, May 07-10, 2023.

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Marco Stafano, Torben Wendt, Stefano Grivet-Talocia, Cheng Yang, Christian Schuster

A Waveform Relaxation Solver for Transient Simulation of Large-Scale Nonlinearly Loaded Shielding Structures Artikel

In: IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 6, pp. 2042 - 2054, 2022.

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Hamideh Esmaeili, Cheng Yang, Christian Schuster

Flexible Numerical Evaluation of Human Head Exposure to a Transmitter Coil for Wireless Power Transfer at 13.56MHz Proceedings Article

In: IEEE International Symposium on Electromagnetic Compatibility - EMC Europe, Gothenburg, Sweden, September 05-08, 2022.

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Michael Wulff, Lei Wang, Cheng Yang, Christian Schuster

Inter Mode Interference in Circular Antenna Arrays for Orbital Angular Momentum (OAM) Based Communication Proceedings Article

In: IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Denver, USA, July 10-15, 2022.

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Michael Wulff, Woocheon Park, Lei Wang, Cheng Yang, Heinz-Dietrich Brüns, Christian Schuster

Shielding of Orbital Angular Momentum Waves by a Cavity With Apertures Artikel

In: IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 3, pp. 692-701, 2022.

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Marco Stafano, Torben Wendt, Cheng Yang, Stefano Grivet-Talocia, Christian Schuster

Regularized and Compressed Large-Scale Rational Macromodeling: Theory and Application to Energy-Selective Shielding Enclosures Artikel

In: IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 5, pp. 1365-1379, 2022.

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Torben Wendt, Cheng Yang, Christian Schuster

Signal Integrity Assessment of External ESD Protection for Gbits/s Data Rates on Ceramic Test Fixture Proceedings Article

In: IEEE Workshop on Signal and Power Integrity (SPI), Siegen, Germany, May 22 -25, 2022. 2022.

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Christian Morten Schierholz, Ihsan Erdin, Jayaprakash Balachandran, Cheng Yang, Christian Schuster

Parametric S-Parameters for PCB based Power Delivery Network Design Using Machine Learning Proceedings Article

In: IEEE Workshop on Signal and Power Integrity (SPI), Siegen, Germany, May 22 -25, 2022.

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Michael Wulff, Lei Wang, Cheng Yang, Christian Schuster

Effect of the Orientation of the Array Elements of Uniform Circular Antenna Arrays on Orbital Angular Momentum (OAM) Modes Proceedings Article

In: German Microwave Conference (GeMiC), Ulm, Germany, May 16 -18, 2022, ISSN: 2167-8022.

Torben Wendt, Stefano, Cheng Yang, Stefano Grivet-Talocia, Christian Schuster

Iteration Dependent Waveform Relaxation for Hybrid Field Nonlinear Circuit Problems Artikel

In: IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 4, pp. 1124-1139, 2022.

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Michael Wulff, Til Hillebrecht, Lei Wang, Cheng Yang, Christian Schuster

Multiconductor Transmission Lines for Orbital Angular Momentum (OAM) Communication Links Artikel

In: IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 2, pp. 329-340, 2022.

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Cheng Yang, Torben Wendt, Stefano, Marc Kopf, Christopher Marc Becker, Stefano Grivet-Talocia, Christian Schuster

Analysis and Optimization of Nonlinear Diode Grids for Shielding of Enclosures With Apertures," Artikel

In: IEEE Transactions on Electromagnetic Compatibility, vol. 63, no. 6, pp. 1884-1895, 2021.

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Torben Wendt, Cheng Yang, Stefano, Stefano Grivet-Talocia, Christian Schuster

Distributed Nonlinear Shielding in Power Delivery Networks on Printed Circuit Boards Proceedings Article

In: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), virtual event, Austin, TX, USA, October 17-20, 2021.

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Ömer Faruk Yildiz, Nico Pathè, Marc Bochard, Cheng Yang, Christian Schuster

Introducing Functional Via Structures to Low Temperature Cofired Ceramics: How to Optimize Reliably and Efficiently Artikel

In: IEEE Electromagnetic Compatibility Magazine, vol. 10, no. 4, pp. 35-45, 2021.

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Allan Sanchesz-Masis, Allan Carmona-Cruz, Christian Morten Schierholz, Xiaomin Duan, Troy J. Beukema, Cheng Yang, Renato Rimolo-Donadio, Christian Schuster

ANN Hyperparameter Optimization by Genetic Algorithms for Via Interconnect Classification Proceedings Article

In: IEEE Workshop on Signal and Power Integrity (SPI), virtual event, Siegen, Germany, May 10-12, 2021.

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Cheng Yang, Christian Morten Schierholz, Eileen Trunczik, Leon Maximilian Helmich, Heinz-Dietrich Brüns, Christian Schuster

Efficient and Flexible Huygens’ Source Replacement of mm-scale Human Brain Implants Proceedings Article

In: Joint IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity (EMCS+SIPI) and Symposium on EMC Europe (EMC Europe), virtual event, Glasgow, Scotland, July 26 - August 20, 2021.

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Ömer Faruk Yildiz, Nico Pathè, Marc Bochard, Cheng Yang, Christian Schuster

Analysis of Differential Crosstalk and Transmission for Via Arrays in Low Temperature Cofired Ceramics Proceedings Article

In: IEEE Workshop on Signal and Power Integrity (SPI), virtual event, Siegen, Germany, May 10-12, 2021.

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Lei Wang, Michael Wulff, Cheng Yang, Christian Schuster

Numerical Analysis of Two MIMO Channels Carrying Orbital Angular Momentum (OAM) Proceedings Article

In: European Conference on Antennas and Propagation (EuCAP), virtual event, Düsseldorf, Germany, March 22-26, 2021.

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Ömer Faruk Yildiz, Ole Thomsen, Marc Bochard, Cheng Yang, Christian Schuster

Vertical Integration of Passive Microwave Components Using Functional Via Structures in LTCC Multilayer Substrates Artikel

In: IEEE Transactions of Components, Packaging and Manufacturing Technology, vol. 11, no. 4, pp. 635-646, 2021.

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Marco Stafano, Stefano Grivet-Talocia, Torben Wendt, Cheng Yang, Christian Schuster

A Multistage Adaptive Sampling Scheme for Passivity Characterization of Large-Scale Macromodels Artikel

In: IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 3, pp. 471-484, 2021.

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