Hamideh Esmaeili, Cheng Yang, Christian Schuster Efficient Iterative Data Generation Using Evaluation of Prioritized Input Parameters in ANNs for SAR Prediction in Human Head Models at 13.56 MHz Artikel In: IEEE Transactions on Electromagnetic Compatibility, Early Access, pp. 1-11, 2024. @article{2024-7,
title = {Efficient Iterative Data Generation Using Evaluation of Prioritized Input Parameters in ANNs for SAR Prediction in Human Head Models at 13.56 MHz},
author = {Hamideh Esmaeili and Cheng Yang and Christian Schuster},
doi = {https://doi.org/10.1109/TEMC.2024.3439468},
year = {2024},
date = {2024-08-15},
journal = {IEEE Transactions on Electromagnetic Compatibility, Early Access, pp. 1-11},
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Cheng Yang, Christian Adam, Sebastian Götschel Complex Near-Field Measurement Using On-The-Fly Scan with In-phase and Quadrature Demodulation Proceedings Article In: 15 German Microwave Conference (GeMiC), Duisburg, Germany, March 11-12, 2024. @inproceedings{2024-1,
title = {Complex Near-Field Measurement Using On-The-Fly Scan with In-phase and Quadrature Demodulation},
author = {Cheng Yang and Christian Adam and Sebastian Götschel},
doi = {10.23919/GeMiC59120.2024.10485338},
year = {2024},
date = {2024-04-04},
urldate = {2024-03-11},
organization = {15 German Microwave Conference (GeMiC), Duisburg, Germany, March 11-12,},
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Hamideh Esmaeili, Cheng Yang, Christian Schuster Physics Inspired Artificial Neural Network Adaptation for SAR Prediction in Bio-EM Problems Proceedings Article In: The 2023 International Microwave Biomedical Conference, Leuven, Belgium, September 11-13, 2023. @inproceedings{2023-13,
title = {Physics Inspired Artificial Neural Network Adaptation for SAR Prediction in Bio-EM Problems},
author = {Hamideh Esmaeili and Cheng Yang and Christian Schuster},
doi = {10.1109/IMBioC56839.2023.10305115},
year = {2023},
date = {2023-09-30},
urldate = {2023-09-30},
organization = {The 2023 International Microwave Biomedical Conference, Leuven, Belgium, September 11-13,},
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Cheng Yang, Christian Adam, Sebastian Götschel Single-probe Near-field Phase Retrieval using On-The-Fly Scan and Hilbert Transform Proceedings Article In: EMC Europe 2023, Krakow, Poland, September 04-08, 2023. @inproceedings{2023-12,
title = {Single-probe Near-field Phase Retrieval using On-The-Fly Scan and Hilbert Transform},
author = {Cheng Yang and Christian Adam and Sebastian Götschel},
doi = {https://doi.org/10.1109/EMCEurope57790.2023.10274183},
year = {2023},
date = {2023-09-06},
urldate = {2023-09-06},
organization = {EMC Europe 2023, Krakow, Poland, September 04-08,},
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Hamideh Esmaeili, Cheng Yang, Christian Schuster SAR Prediction in Human Head Tissues with Varying Material Parameters Using an Artificial Neural Network Proceedings Article In: Annual Conference of BioEM, Oxford, United Kingdom, June 18-24, 2023. @inproceedings{2023-6,
title = {SAR Prediction in Human Head Tissues with Varying Material Parameters Using an Artificial Neural Network},
author = {Hamideh Esmaeili and Cheng Yang and Christian Schuster},
year = {2023},
date = {2023-06-19},
urldate = {2023-06-19},
organization = {Annual Conference of BioEM, Oxford, United Kingdom, June 18-24,},
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pubstate = {published},
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Jose Enrique Hernandez-Bonilla, Golzar Alavi, Cheng Yang, Christian Schuster Measurement of Temperature and Humidity Dependance of Automotive-Grade Interconnects Proceedings Article In: IEEE Workshop on Signal and Power Integrity (SPI), Aveiro, Portugal, May 07-10, 2023. @inproceedings{2023-2,
title = {Measurement of Temperature and Humidity Dependance of Automotive-Grade Interconnects},
author = {Jose Enrique Hernandez-Bonilla and Golzar Alavi and Cheng Yang and Christian Schuster},
doi = {10.1109/SPI57109.2023.10145521},
year = {2023},
date = {2023-05-07},
urldate = {2023-05-07},
organization = {IEEE Workshop on Signal and Power Integrity (SPI), Aveiro, Portugal, May 07-10,},
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Marco Stafano, Torben Wendt, Stefano Grivet-Talocia, Cheng Yang, Christian Schuster A Waveform Relaxation Solver for Transient Simulation of Large-Scale Nonlinearly Loaded Shielding Structures Artikel In: IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 6, pp. 2042 - 2054, 2022. @article{2022-18,
title = {A Waveform Relaxation Solver for Transient Simulation of Large-Scale Nonlinearly Loaded Shielding Structures},
author = {Marco Stafano and Torben Wendt and Stefano Grivet-Talocia and Cheng Yang and Christian Schuster},
doi = {10.1109/TEMC.2022.3204778},
year = {2022},
date = {2022-09-22},
urldate = {2022-09-22},
journal = {IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 6, pp. 2042 - 2054},
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Hamideh Esmaeili, Cheng Yang, Christian Schuster Flexible Numerical Evaluation of Human Head Exposure to a Transmitter Coil for Wireless Power Transfer at 13.56MHz Proceedings Article In: IEEE International Symposium on Electromagnetic Compatibility - EMC Europe, Gothenburg, Sweden, September 05-08, 2022. @inproceedings{2022-20,
title = {Flexible Numerical Evaluation of Human Head Exposure to a Transmitter Coil for Wireless Power Transfer at 13.56MHz},
author = {Hamideh Esmaeili and Cheng Yang and Christian Schuster},
doi = {https://doi.org/10.1109/EMCEurope51680.2022.9900973},
year = {2022},
date = {2022-09-06},
urldate = {2022-09-06},
organization = {IEEE International Symposium on Electromagnetic Compatibility - EMC Europe, Gothenburg, Sweden, September 05-08,},
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Michael Wulff, Lei Wang, Cheng Yang, Christian Schuster Inter Mode Interference in Circular Antenna Arrays for Orbital Angular Momentum (OAM) Based Communication Proceedings Article In: IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Denver, USA, July 10-15, 2022. @inproceedings{2022-19,
title = {Inter Mode Interference in Circular Antenna Arrays for Orbital Angular Momentum (OAM) Based Communication},
author = {Michael Wulff and Lei Wang and Cheng Yang and Christian Schuster},
doi = {10.1109/AP-S/USNC-URSI47032.2022.9887018},
year = {2022},
date = {2022-07-15},
urldate = {2022-07-15},
organization = {IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Denver, USA, July 10-15,},
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Michael Wulff, Woocheon Park, Lei Wang, Cheng Yang, Heinz-Dietrich Brüns, Christian Schuster Shielding of Orbital Angular Momentum Waves by a Cavity With Apertures Artikel In: IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 3, pp. 692-701, 2022. @article{2022-15,
title = {Shielding of Orbital Angular Momentum Waves by a Cavity With Apertures},
author = {Michael Wulff and Woocheon Park and Lei Wang and Cheng Yang and Heinz-Dietrich Brüns and Christian Schuster},
doi = {10.1109/TEMC.2022.3144446},
year = {2022},
date = {2022-06-14},
urldate = {2022-06-14},
journal = {IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 3, pp. 692-701},
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Marco Stafano, Torben Wendt, Cheng Yang, Stefano Grivet-Talocia, Christian Schuster Regularized and Compressed Large-Scale Rational Macromodeling: Theory and Application to Energy-Selective Shielding Enclosures Artikel In: IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 5, pp. 1365-1379, 2022. @article{2022-19b,
title = {Regularized and Compressed Large-Scale Rational Macromodeling: Theory and Application to Energy-Selective Shielding Enclosures},
author = {Marco Stafano and Torben Wendt and Cheng Yang and Stefano Grivet-Talocia and Christian Schuster},
doi = {10.1109/TEMC.2022.3176093},
year = {2022},
date = {2022-06-07},
urldate = {2022-06-07},
journal = {IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 5, pp. 1365-1379},
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pubstate = {published},
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Christian Morten Schierholz, Ihsan Erdin, Jayaprakash Balachandran, Cheng Yang, Christian Schuster Parametric S-Parameters for PCB based Power Delivery Network Design Using Machine Learning Proceedings Article In: IEEE Workshop on Signal and Power Integrity (SPI), Siegen, Germany, May 22 -25, 2022. @inproceedings{2022-3,
title = {Parametric S-Parameters for PCB based Power Delivery Network Design Using Machine Learning},
author = {Christian Morten Schierholz and Ihsan Erdin and Jayaprakash Balachandran and Cheng Yang and Christian Schuster},
doi = {https://doi.org/10.1109/SPI54345.2022.9874946},
year = {2022},
date = {2022-05-22},
urldate = {2022-05-22},
organization = {IEEE Workshop on Signal and Power Integrity (SPI), Siegen, Germany, May 22 -25,},
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Torben Wendt, Cheng Yang, Christian Schuster Signal Integrity Assessment of External ESD Protection for Gbits/s Data Rates on Ceramic Test Fixture Proceedings Article In: IEEE Workshop on Signal and Power Integrity (SPI), Siegen, Germany, May 22 -25, 2022. 2022. @inproceedings{2022-5,
title = {Signal Integrity Assessment of External ESD Protection for Gbits/s Data Rates on Ceramic Test Fixture},
author = {Torben Wendt and Cheng Yang and Christian Schuster},
doi = {https://doi.org/10.1109/SPI54345.2022.9874937},
year = {2022},
date = {2022-05-22},
urldate = {2022-05-22},
organization = {IEEE Workshop on Signal and Power Integrity (SPI), Siegen, Germany, May 22 -25, 2022.},
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Michael Wulff, Lei Wang, Cheng Yang, Christian Schuster Effect of the Orientation of the Array Elements of Uniform Circular Antenna Arrays on Orbital Angular Momentum (OAM) Modes Proceedings Article In: German Microwave Conference (GeMiC), Ulm, Germany, May 16 -18, 2022, ISSN: 2167-8022. @inproceedings{2022-14,
title = {Effect of the Orientation of the Array Elements of Uniform Circular Antenna Arrays on Orbital Angular Momentum (OAM) Modes},
author = {Michael Wulff and Lei Wang and Cheng Yang and Christian Schuster},
issn = {2167-8022},
year = {2022},
date = {2022-05-16},
urldate = {2022-05-16},
organization = {German Microwave Conference (GeMiC), Ulm, Germany, May 16 -18,},
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Torben Wendt, Stefano, Cheng Yang, Stefano Grivet-Talocia, Christian Schuster Iteration Dependent Waveform Relaxation for Hybrid Field Nonlinear Circuit Problems Artikel In: IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 4, pp. 1124-1139, 2022. @article{2022-16,
title = {Iteration Dependent Waveform Relaxation for Hybrid Field Nonlinear Circuit Problems},
author = {Torben Wendt and Stefano and Cheng Yang and Stefano Grivet-Talocia and Christian Schuster},
doi = {10.1109/TEMC.2022.3153114},
year = {2022},
date = {2022-03-25},
urldate = {2022-03-25},
journal = {IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 4, pp. 1124-1139},
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Michael Wulff, Til Hillebrecht, Lei Wang, Cheng Yang, Christian Schuster Multiconductor Transmission Lines for Orbital Angular Momentum (OAM) Communication Links Artikel In: IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 2, pp. 329-340, 2022. @article{2022-2,
title = {Multiconductor Transmission Lines for Orbital Angular Momentum (OAM) Communication Links},
author = {Michael Wulff and Til Hillebrecht and Lei Wang and Cheng Yang and Christian Schuster},
doi = {10.1109/TCPMT.2022.3140920},
year = {2022},
date = {2022-01-06},
urldate = {2022-01-06},
journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 2, pp. 329-340},
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Cheng Yang, Torben Wendt, Stefano, Marc Kopf, Christopher Marc Becker, Stefano Grivet-Talocia, Christian Schuster Analysis and Optimization of Nonlinear Diode Grids for Shielding of Enclosures With Apertures," Artikel In: IEEE Transactions on Electromagnetic Compatibility, vol. 63, no. 6, pp. 1884-1895, 2021. @article{Yang2021,
title = {Analysis and Optimization of Nonlinear Diode Grids for Shielding of Enclosures With Apertures,"},
author = {Cheng Yang and Torben Wendt and Stefano and Marc Kopf and Christopher Marc Becker and Stefano Grivet-Talocia and Christian Schuster},
editor = {IEEE Transactions Electromagnetic Compatibility},
doi = {10.1109/TEMC.2021.3073106},
year = {2021},
date = {2021-12-01},
urldate = {2021-12-01},
journal = {IEEE Transactions on Electromagnetic Compatibility, vol. 63, no. 6, pp. 1884-1895},
keywords = {},
pubstate = {published},
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Torben Wendt, Cheng Yang, Stefano, Stefano Grivet-Talocia, Christian Schuster Distributed Nonlinear Shielding in Power Delivery Networks on Printed Circuit Boards Proceedings Article In: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), virtual event, Austin, TX, USA, October 17-20, 2021. @inproceedings{2021-8,
title = {Distributed Nonlinear Shielding in Power Delivery Networks on Printed Circuit Boards},
author = {Torben Wendt and Cheng Yang and Stefano and Stefano Grivet-Talocia and Christian Schuster},
doi = {10.1109/EPEPS51341.2021.9609177},
year = {2021},
date = {2021-11-24},
urldate = {2021-11-24},
organization = {IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), virtual event, Austin, TX, USA, October 17-20,},
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Ömer Faruk Yildiz, Nico Pathè, Marc Bochard, Cheng Yang, Christian Schuster Introducing Functional Via Structures to Low Temperature Cofired Ceramics: How to Optimize Reliably and Efficiently Artikel In: IEEE Electromagnetic Compatibility Magazine, vol. 10, no. 4, pp. 35-45, 2021. @article{2021-11,
title = {Introducing Functional Via Structures to Low Temperature Cofired Ceramics: How to Optimize Reliably and Efficiently},
author = {Ömer Faruk Yildiz and Nico Pathè and Marc Bochard and Cheng Yang and Christian Schuster},
doi = {10.1109/MEMC.2021.9705232},
year = {2021},
date = {2021-10-01},
urldate = {2021-10-01},
journal = {IEEE Electromagnetic Compatibility Magazine, vol. 10, no. 4, pp. 35-45},
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Allan Sanchesz-Masis, Allan Carmona-Cruz, Christian Morten Schierholz, Xiaomin Duan, Troy J. Beukema, Cheng Yang, Renato Rimolo-Donadio, Christian Schuster ANN Hyperparameter Optimization by Genetic Algorithms for Via Interconnect Classification Proceedings Article In: IEEE Workshop on Signal and Power Integrity (SPI), virtual event, Siegen, Germany, May 10-12, 2021. @inproceedings{2021-9,
title = {ANN Hyperparameter Optimization by Genetic Algorithms for Via Interconnect Classification},
author = {Allan Sanchesz-Masis and Allan Carmona-Cruz and Christian Morten Schierholz and Xiaomin Duan and Troy J. Beukema and Cheng Yang and Renato Rimolo-Donadio and Christian Schuster},
doi = {10.1109/SPI52361.2021.9505202},
year = {2021},
date = {2021-08-06},
urldate = {2021-08-06},
organization = {IEEE Workshop on Signal and Power Integrity (SPI), virtual event, Siegen, Germany, May 10-12,},
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Cheng Yang, Christian Morten Schierholz, Eileen Trunczik, Leon Maximilian Helmich, Heinz-Dietrich Brüns, Christian Schuster Efficient and Flexible Huygens’ Source Replacement of mm-scale Human Brain Implants Proceedings Article In: Joint IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity (EMCS+SIPI) and Symposium on EMC Europe (EMC Europe), virtual event, Glasgow, Scotland, July 26 - August 20, 2021. @inproceedings{2021-6,
title = {Efficient and Flexible Huygens’ Source Replacement of mm-scale Human Brain Implants},
author = {Cheng Yang and Christian Morten Schierholz and Eileen Trunczik and Leon Maximilian Helmich and Heinz-Dietrich Brüns and Christian Schuster},
doi = {10.1109/EMC/SI/PI/EMCEurope52599.2021.9559298},
year = {2021},
date = {2021-07-26},
urldate = {2021-07-26},
journal = {2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium},
organization = {Joint IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity (EMCS+SIPI) and Symposium on EMC Europe (EMC Europe), virtual event, Glasgow, Scotland, July 26 - August 20,},
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Ömer Faruk Yildiz, Nico Pathè, Marc Bochard, Cheng Yang, Christian Schuster Analysis of Differential Crosstalk and Transmission for Via Arrays in Low Temperature Cofired Ceramics Proceedings Article In: IEEE Workshop on Signal and Power Integrity (SPI), virtual event, Siegen, Germany, May 10-12, 2021. @inproceedings{2021-12b,
title = {Analysis of Differential Crosstalk and Transmission for Via Arrays in Low Temperature Cofired Ceramics},
author = {Ömer Faruk Yildiz and Nico Pathè and Marc Bochard and Cheng Yang and Christian Schuster},
doi = {10.1109/SPI52361.2021.9505214},
year = {2021},
date = {2021-05-10},
urldate = {2021-05-10},
organization = {IEEE Workshop on Signal and Power Integrity (SPI), virtual event, Siegen, Germany, May 10-12,},
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Lei Wang, Michael Wulff, Cheng Yang, Christian Schuster Numerical Analysis of Two MIMO Channels Carrying Orbital Angular Momentum (OAM) Proceedings Article In: European Conference on Antennas and Propagation (EuCAP), virtual event, Düsseldorf, Germany, March 22-26, 2021. @inproceedings{2021-10,
title = {Numerical Analysis of Two MIMO Channels Carrying Orbital Angular Momentum (OAM)},
author = {Lei Wang and Michael Wulff and Cheng Yang and Christian Schuster},
doi = {10.23919/EuCAP51087.2021.9411418},
year = {2021},
date = {2021-04-27},
urldate = {2021-04-27},
organization = {European Conference on Antennas and Propagation (EuCAP), virtual event, Düsseldorf, Germany, March 22-26,},
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Ömer Faruk Yildiz, Ole Thomsen, Marc Bochard, Cheng Yang, Christian Schuster Vertical Integration of Passive Microwave Components Using Functional Via Structures in LTCC Multilayer Substrates Artikel In: IEEE Transactions of Components, Packaging and Manufacturing Technology, vol. 11, no. 4, pp. 635-646, 2021. @article{2021-5,
title = {Vertical Integration of Passive Microwave Components Using Functional Via Structures in LTCC Multilayer Substrates},
author = {Ömer Faruk Yildiz and Ole Thomsen and Marc Bochard and Cheng Yang and Christian Schuster},
doi = {10.1109/TCPMT.2021.3068324},
year = {2021},
date = {2021-03-23},
urldate = {2021-03-23},
journal = {IEEE Transactions of Components, Packaging and Manufacturing Technology, vol. 11, no. 4, pp. 635-646},
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Marco Stafano, Stefano Grivet-Talocia, Torben Wendt, Cheng Yang, Christian Schuster A Multistage Adaptive Sampling Scheme for Passivity Characterization of Large-Scale Macromodels Artikel In: IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 3, pp. 471-484, 2021. @article{2021-4,
title = {A Multistage Adaptive Sampling Scheme for Passivity Characterization of Large-Scale Macromodels},
author = {Marco Stafano and Stefano Grivet-Talocia and Torben Wendt and Cheng Yang and Christian Schuster},
doi = {10.1109/TCPMT.2021.3056746},
year = {2021},
date = {2021-03-03},
urldate = {2021-03-03},
journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 3, pp. 471-484},
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