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🚀 Exciting PhD Opportunity at TU Hamburg! 🚀
Are you passionate about Machine Learning, Electrical Engineering, or Physics? TU Hamburg is offering a PhD position as part of the EU-funded DN PATTERN project (Marie Skłodowska-Curie Actions) [https://pattern-dn.eu]!
🔹 Topic: AI-driven simulation and optimization for electromagnetic compatibility
🔹 International research with secondments at Nexperia (Germany) & IETR – Institut d’Electronique et des Technologies du numéRique – UMR CNRS 6164 (France)
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📅 Application deadline: March 31, 2025
📍 Start date: June 2, 2025
💡 More info & application: [https://lnkd.in/eY9Dvx2T]
12.02.2025: Leading International Engineering Association Honors Prof. Alexander Koelpin and Prof. Christian Schuster as IEEE Fellows. At the beginning of the year, Prof. Dr. Alexander Kölpin from the Institute of High-Frequency Technology and Prof. Dr. Christian Schuster from the Institute für Theoretische Elektrotechnik at Hamburg University of Technology (TUHH) were honored by the IEEE professional association for their outstanding scientific achievements. The two new Fellows celebrated their success on February 12, 2025, together with colleagues from the Faculty of Electrical Engineering, Computer Science, and Mathematics. We extend our heartfelt congratulations to both of them!
The photo shows Prof. Christian Schuster (left) and Prof. Alexander Kölpin (right) with the Dean of Studies Prof. Daniel Ruprecht (center).
28.01. – 31.01.2025: We are thrilled to share that the Institut für Theoretische Elektrotechnik (TET) at Hamburg University of Technology (TUHH) and our esteemed partners had a fantastic presence at this years DesignCon 2025! We had the honor of presenting two research papers, during the oral sessions, contributing valuable insights to the field of high-speed PCB design:
🔹Prediction of Dielectric Constant and Copper Roughness Parameters of High-Speed Automotive PCB Digital Interconnects Using a Data-Based Model – exploring machine learning modeling techniques for improved automotive interconnect design. By Jose Enrique Hernandez Bonilla (Bosch), Golzar Alavi (Bosch), Torsten Reuschel (University of New Brunswick), Cheng Yang (TUHH) and Christian Schuster (TUHH).
🔹 Impedance Profile Prediction and Classification for PCB-Based PDN Decoupling Using Autoencoders – leveraging machine learning for efficient power distribution network optimization. By Youcef Hassab (TUHH), Jan Heßling (TUHH), Morten Schierholz, Jayaprakash Balachandran (dMatrix), Ihsan Erdin (Celestica), and Christian Schuster (TUHH).
The photo shows Youcef Hassab (left) and Jan Hessling (right).
29.01.2025: At DesignCon 2025 in January this year, Mr. Yousef Hassab had the honor of accepting the DesignCon 2024 Early-Career BPA winning paper on behalf of all contributors. In January 2024, Mr. Youcef Hassab (TUHH), together with Mr. Morten Schierholz, Ihsan Erdin (Celestica Inc.), Jayaprakash Balachandran (d-Matrix), and Christian Schuster, received the DesignCon 2024 Early-Career Best Paper Award for the conference paper “Applying Techniques of Transfer & Active Learning to Practical PCB Noise Decoupling.” In the photo, Mr. Hassab can be seen accepting the award at the ceremony.
20.12.2024: The Institut für Theoretische Elektrotechnik hosted Dr.-Ing. Thomas Fiedler, Project Leader of the Electromagnetic Simulations and RF Safety Group at the Division of Medical Physics in Radiology, German Cancer Research Center (DKFZ German Cancer Research Center), for an insightful presentation on MRI Safety at 7 Tesla and Beyond. Dr. Fiedler’s presentation covered the electromagnetic fields used in MRI and the associated patient safety risks. He also introduced methods for optimizing the RF transmit field using multi-channel RF transmission systems and real-time SAR monitoring techniques. Following the talk, we had the opportunity to exchange ideas on our recent work, including full-wave numerical SAR prediction using machine learning presented by M. Sc. Hamideh Esmaeili. We also showcased, firstly under the water, our high-speed, high-resolution near-field measurement capabilities. Thank you Dr. Fiedler, we are excited for future collaborations and challenges in advancing MRI technologies! The picture shows from left to right: Dr. Cheng Yang, Dr. Thomas Fiedler and Hamideh Esmaeili
27.11.2024: We are honored and delighted to announce that the IEEE Board of Directors, at its November 2024 meeting, has elevated Prof. Schuster to the status of IEEE Fellow, effective January 1, 2025, with the following citation:
For contributions to physics-based modeling, design, and optimization of interconnects in servers and networking equipment.
Special thanks are extended to his nominator, Prof. James Drewniak, for his invaluable guidance and encouragement, to the exceptional members of the IEEE EMC Society, and to Hamburg University of Technology, which has supported Prof. Schuster’s research for over 18 years.
18.11.2024: We are thrilled to share that our paper, “Machine Learning Based Data Validation for Signal Integrity and Power Integrity Using Supervised Time Series Classification”, has been accepted for publication in the IEEE Transactions on Electromagnetic Compatibility. This work is the result of a fruitful collaboration between researchers from the Institut für Theoretische Elektrotechnik of the Hamburg University of Technology and the Chair of Integrated Electronic Systems of the Otto-von-Guericke University Magdeburg Fabian Lurz. In this work, we present a novel machine learning-based approach for validating data in signal integrity (SI) and power integrity (PI). By training time series classification networks on data labeled by expert engineers, we replicate human visual assessments to predict the agreement between two curves. In comparison to other error and similarity metrics, this method offers the advantage of capturing domain-specific expert knowledge in the comparison of curves. This approach allows the systematic, fast and objective validation of large datasets.
Details:
📌 Title: Machine Learning Based Data Validation for Signal Integrity and Power Integrity Using Supervised Time Series Classification.
📌 Authors: Youcef Hassab, Til Hillebrecht, Fabian Lurz, Christian Schuster.
📌 Journal: IEEE Transactions on Electromagnetic Compatibility.
📌 Date: October 2024.
📌 DOI: 10.1109/TEMC.2024.3450307.
29.11.2024: Hamburg University of Technology and the Institut für Theoretische Elektrotechnik had the honor of hosting Dr.-Ing. Hubert Harrer, Senior Technical Staff Member at IBM Systems and Technology Group, IBM Deutschland GmbH. Dr.-Ing. Hubert Harrer received his Dipl.-Ing. degree in 1989 and Ph.D. in 1992 from the Technical University of Munich, Germany. Since 1994 he has worked for IBM in the Boeblingen Packaging Department. In 1999 he was on international assignment at IBM Poughkeepsie, NY, USA, leading the z900 MCM designs.
Dr. Harrer gave a presentation about: “30 Years of IBM System z Packaging”.
“System z” or “IBM Z” is a family name IBM uses for its Z architecture main frame computers. The systems are fully backward compatible and the descendants of the famous IBM System/360 first introduced in 1965.
In this presentation, Dr. Harrer reflected on his three decades of work in the IBM Systems and Technology Group, where he was responsible for the design of printed circuit boards and packages for System z servers.
We are deeply grateful for the opportunity to learn from such an experienced and inspiring professional. Thank you, Dr. Harrer, for sharing your knowledge and passion with us!