Publications
2024
Data-Efficient Prediction of the Specific Absorption Rate in a Human Head Model Exposed to a Plane EM Wave Using Gaussian Process Regression Proceedings Article
In: 2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Bruges, Belgium, September 2-5 2024.
Machine Learning Based Data Validation for Signal Integrity and Power Integrity Using Supervised Time Series Classification Journal Article
In: IEEE Transactions on Electromagnetic Compatibility, Early Access, pp. 1 - 9, 2024.
The EMC of Orbital Angular Momentum (OAM) Based Wireless Communication Journal Article
In: IEEE Transaction on Electromagnetic Compatibility Magazine, Vol.: 13, Issue: 2, pp. 54 - 64, 2024.
Generation and Application of a Very Large Dataset for Signal Integrity Via Array and Link Analysis Journal Article
In: IEEE Transactions on Electromagnetic Compatibility, Early Access, pp. 1 -10, 2024.
In: IEEE Transactions on Electromagnetic Compatibility, Early Access, pp. 1-11, 2024.
Dimensional Reduction by Auto-Encoders in Machine Learning Based Power Integrity Analysis Proceedings Article Forthcoming
In: 2024 IEEE 28th Workshop on Signal and Power Integrity (SPI), Lisbon, Portugal, May 12-15, Forthcoming.
PCB based Power Delivery Network Analysis Using Transfer Learning and Artificial Neural Networks Proceedings Article
In: 2024 IEEE 28th Workshop on Signal and Power Integrity (SPI), Lisbon, Portugal, May 12-15, 2024.
Application of Gaussian Process Regression for Data Efficient Prediction of PCB-based Power Delivery Network Impedance Features Proceedings Article
In: 2024 IEEE 28th Workshop on Signal and Power Integrity (SPI), Lisbon, Portugal, May 12-15 2024.
Complex Near-Field Measurement Using On-The-Fly Scan with In-phase and Quadrature Demodulation Proceedings Article
In: 15 German Microwave Conference (GeMiC), Duisburg, Germany, March 11-12, 2024.
Applying Techniques of Transfer and Active Learning to Practical PCB Noise Decoupling Proceedings Article
In: DesignCon 2024, Sanata Clara, USA, January 30 - February 1, 2024.
2023
FNNs Models for Regression of S-Parameters in Multilayer Interconnects with Different Electrical Lengths Proceedings Article
In: 2023 IEEE MTT-S Latin America Microwave Conference (LAMC), San José, Costa Rica, December 06-08, 2023.
Influence of the Communication Environment on Orbital Angular Momentum (OAM) Mode Orthogonality Proceedings Article
In: European Microwave Conference (EuMC), Berlin, Germany, September 19-21, 2023.
Automated Generation and Correlation of Physics-Based Via Models with Full-Wave Simulation for an SI/PI Database Proceedings Article
In: Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Milpitas, CA, USA, October 15-18, 2023.
Physics Inspired Artificial Neural Network Adaptation for SAR Prediction in Bio-EM Problems Proceedings Article
In: The 2023 International Microwave Biomedical Conference, Leuven, Belgium, September 11-13, 2023.
Modeling Electrically Long Interconnects Using Physics-Informed Delayed Gaussian Processes Journal Article
In: IEEE Transactions on Electromagnetic Compatibility, vol. 65, no. 6, pp. 1715 - 1723, 2023.
Single-probe Near-field Phase Retrieval using On-The-Fly Scan and Hilbert Transform Proceedings Article
In: EMC Europe 2023, Krakow, Poland, September 04-08, 2023.
Construction of Reciprocal Macromodels in the Loewner Matrix Framework Journal Article
In: IEEE Transactions on Microwave Theory and Techniques, vol. 71, no. 8, pp. 3561-3571, 2023.
Simulating Aperture Coupling of OAM Waves Through an Infinite PEC Plane Using EFIE-MoM Part I Validation and Numerical Accuracy Journal Article
In: IEEE Transactions on Electromagnetic Compatibility, vol. 65, no. 5, pp. 1389-1399, 2023.
Simulating Aperture Coupling of OAM Waves Through an Infinite PEC Plane Using EFIE-MoM Part II Application and Interpretation Journal Article
In: IEEE Transactions on Electromagnetic Compatibility, vol. 65, no. 5, pp. 1400-1409, 2023.
Engineering-Informed Design Space Reduction for PCB Based Power Delivery Networks Journal Article
In: IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 13, no. 10, pp. 1613 - 1623, 2023.
Hybrid Simulation of Multiport Structures for Diode Based Shielding Applications PhD Thesis
2023, ISBN: 978-3-8440-9129-8.
SAR Prediction in Human Head Tissues with Varying Material Parameters Using an Artificial Neural Network Proceedings Article
In: Annual Conference of BioEM, Oxford, United Kingdom, June 18-24, 2023.
Bayesian Optimization of First-Order Continuous-Time Linear Equalization in High-Speed Links Including Crosstalk Proceedings Article
In: IEEE Workshop on Signal and Power Integrity (SPI), Aveiro, Portugal, May 07-10, 2023.
Modeling S-parameters of Interconnects using Periodic Gaussian Process Kernels Proceedings Article
In: IEEE Workshop on Signal and Power Integrity (SPI), Aveiro, Portugal, May 07-10, 2023.
Measurement of Temperature and Humidity Dependance of Automotive-Grade Interconnects Proceedings Article
In: IEEE Workshop on Signal and Power Integrity (SPI), Aveiro, Portugal, May 07-10, 2023.